We can help you realize your goals whether you’re transitioning to 300mm wafers, have a challenging metallization requirement or need to precisely align a magnetic thin film. Through our proprietary and patented technologies, we’ve been delivering solutions to the various segments of the semiconductor industry including wafer processing, packaging, and test / measurement.
We provide the magnets that make ferrofluidic sealing a reality.
Specially designed permanent and electromagnetic frames and dipoles are utilized to align thin films, while our patented magnetron designs enhance the sputtering effectiveness of ferrous targets. This alignment of films is critical in the development of M-RAM (magnetic random access memory), an evolving technological area in which we have much to offer.
Packaging solutions include high performance motors for wire bonding equipment as well as torque couplings for the sealless translation of rotation or linear motion into vacuum chambers. Various permanent and electromagnetic products for wafer inspection equipment are among the solutions we provide for test and measurement manufacturers.
Physical Vapor Deposition
- Sputtering Magnetrons
Chemical Vapor Deposition
Inductively Coupled – Plasma Enhanced Chemical Vapor Deposition
Lithography
- High-performance motion for reticle and wafer stages
Rotary motor and magnetic couplings for excimer lasers
Ion Implantation
- Flag Faradays
- Electromagnets
- Beam Focusing
- Beam Bending
Testing & Metrology
- Permanent, Electromagnets and Hybrid – Magnetic Lens
Permanent and Electromagnets for magnetic film testing
Wire Bonding
- Magnetic assemblies for low Inertia VC Motors
Recording Media
- Magnetrons
- Bulk Erase Tools-
- Disk Erase Tools
Recording Heads
- Magnetrons
- Wafer Bias Magnets-
- Wafer Initialization
- HGA Head Setters
- Wafer Plating Magnets
Additional Magnetic Technologies
- Magnetic Couplings – Wafer Handling
- Hermetically Sealed Magnets for Rotary and Linear Motors
- Magnetic Sensors
- Vacuum Pressure
- Mass Spectrometers